Mask writers are devices that use irradiation by electron beams to draw a fine electronic circuit pattern onto a template (the mask), which has been formed by a silica glass substrate with photosensitive resin. Single-beam mask writers write data to the mask by concentrating the single electron beam on a single position over an electromagnetic field and then deflecting the beam to the position to be irradiated by the polarizer.

Large circuit patterns can be created by repeating beam deflection and then moving the stage upon which the substrate is mounted.  Using thousands of tiny beamlets, multi-beam mask writers can pattern or write advanced masks at a faster rate compared to VSB-based tools. With chip miniaturization making device designs more complex and requiring the use of more masks, multibeam systems are coming into demand.

Global main manufacturers of multi-beam mask writer include IMS Nanofabrication and NuFlare Technology. IMS Nanofabrication develop and produce the world’s first multi-beam mask writers for the global semiconductor industry. IMS Nanofabrication hold a revenue share of 74.42% in 2022. Actually, only these two manufacturers can produce multi-beam mask writer globally currently.

Multi-beam Mask Writer can be used to produce wafer and EUV mask. During wafer manufacturing, leading wafer manufacturers, such as TSMC and Samsung, usually use self-made photomasks. In addition to fab self-supply, there are also some leading commercial photomask suppliers that require multi-beam mask writers, such as Photronics and DNP.

Global multi-beam mask writer market size was value at US$ 646.76 million in 2022 and is forecast to be a readjusted size of US$ 1000.94 million by 2029 with a CAGR of 6.67% during the forecast period 2023-2029.

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