Global HTCC Package Market to Reach $4.5 Billion by 2028, According to New Report!!

HTCC means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C.

HTCC substrate provides the properties of high strength, good heat dissipation, and high reliability. HTCC technology is also used for a multi-layer packaging for the electronics industry, such as Communication package, consumer electronics, industrial laser, and military electronics, MEMS, microprocessor, and RF applications.

This report studies HTCC Package, covers the HTCC Ceramic Substrates, HTCC Ceramic Shell/Housings, and HTCC SMD Ceramic Packages. Due to the COVID-19 pandemic and Russo-Ukrainian war, the global HTCC market size was valued at US$ 2,781 million in 2021 and is forecast to a readjusted size of US$ 4,541 million by 2028 with a CAGR of 6.86% during the forecast period 2022-2028.

Japan is the largest producer of HTCC in the world, its HTCC market size was valued at US$ 1956 million in 2021, while China is the second producer of HTCC, and the Chinese market size was valued at US$ 674 million. The proportion of the Japan was 70% in 2021, while China percentage was 22.2%, and it is predicted that China market share will reach 32.9% in 2028, trailing a CAGR of 11.29 % through the analysis period.

The global major manufacturers of HTCC include Kyocera, Maruwa, NGK Spark Plug, Hebei Sinopack Electronic Tech & CETC 13, and Chaozhou Three-Circle, etc. In terms of revenue, the global four largest players hold an 84% market share of HTCC in 2021.

In terms of HTCC products segment, HTCC Ceramic Shell/Housings and HTCC SMD Ceramic Packages hold a share 77.2% and 17.7% in 2021, respectively.

For HTCC Ceramic Shell/Housings, Kyocera, NGK/NTK, and Hebei Sinopack Electronic Tech & CETC 13 are the key producers, these three players occupied for about 86%, while for HTCC SMD Ceramic Packages, Kyocera and Chaozhou Three-Circle (Group) the world’s two largest players, both holds a share about 85 percent in 2021. For HTCC Ceramic Substrates, key players are Kyocera, Maruwa, NGK/NTK, NEO Tech, CETC 43 (Shengda Electronics), and Hebei Sinopack Electronic Tech.

New Report Available to Purchase !! – Here

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